Surface mounting of devices on both sides of a circuit board

Details Surface mounting of devices on both sides of a circuit board Surface mounting of devices on both sides of a circuit board

H - Electricity

05

K

356/8

H05K 3/34 (2006.01) H05K 7/12 (2006.01)

Patent

CA 1219082

SURFACE MOUNTING OF DEVICES ON BOTH SIDES OF A CIRCUIT BOARD Abstract of the Disclosure Surface mounted components or devices on circuit boards can be connected on a first side by reflow soldering and then the circuit board turned over and further devices mounted on the other side and also connected by reflow soldering. The devices connected on the first side are retained in position by the surface tension of a molten solder pad. Solder paste is applied to form a hump and then reflowed to form a solder pad, for example about .010 inches thick. After positioning devices on the board, on the solder pads, they are connected by reflow soldering. On turning the board over, further surface mounting devices can be positioned and connected, or other forms such as leaded components, can be connected, by reflow soldering, without loss of the first connected devices. -i-

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