Surface treating agent for copper or copper alloy

C - Chemistry – Metallurgy – 23 – C

Patent

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Details

C23C 22/52 (2006.01) C23F 11/14 (2006.01) H05K 3/28 (2006.01)

Patent

CA 2197965

A surface treating agent for copper and a copper alloy, comprising an aqueous solution containing an imidazole compound or a benzimidazole compound, a complexon, and iron ions. The agent forms a chemical film selectively on the surface of copper while forming no film on other metals.

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