Surface treating solutions and cleaning method

Details Surface treating solutions and cleaning method Surface treating solutions and cleaning method

C - Chemistry, Metallurgy

11

D

C11D 7/18 (2006.01) C01B 15/037 (2006.01) C11D 3/36 (2006.01) C11D 3/39 (2006.01) C11D 7/06 (2006.01) C11D 7/16 (2006.01) H01L 21/306 (2006.01) H01L 21/46 (2006.01)

Patent

CA 2059841

ABSTRACT OF THE DISCLOSURE A combination of a first surface treating solution comprising an inorganic or organic alkali such as ammonia or a quaternary ammonium hydroxide, hydrogen peroxide, water and a second surface treating solution of ultra-pure water, at least one of the first and second surface treating solutions containing as a complexing agent a compound having one or more phosphonic acid groups in the molecule and showing chelating ability, or an oxidized form thereof, or polyphosphoric acid or a salt thereof, is effective for making semiconductor surfaces free from harmful metallic impurities such as Fe, A?, Zn, etc.

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