Surface treatment method of electrodeposition type...

Details Surface treatment method of electrodeposition type... Surface treatment method of electrodeposition type...

C - Chemistry, Metallurgy

25

D

C25D 3/02 (2006.01) C25D 7/00 (2006.01) G03F 7/16 (2006.01) H05K 3/00 (2006.01)

Patent

CA 2109678

18 ABSTRACT OF THE DISCLOSURE Disclosed is a process for surface treating an electrodeposition type photosensitive resin film, comprising electrocoating a photosensitive resin composition on a copper plate for a printed circuit board to form a resist layer, characterized by that an aqueous solution containing a surfactant is applied on the electrodoposited film and then dried.

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