B - Operations – Transporting – 32 – B
Patent
B - Operations, Transporting
32
B
B32B 15/08 (2006.01) H05K 1/00 (2006.01) H05K 3/38 (2006.01)
Patent
CA 2287707
In one embodiment, the present invention relates to a flexible laminate, comprising a first flexible polymeric film; a copper layer having a microcracking prevention layer on at least one side the microcracking prevention layer sufficient to prevent microcracks in a copper layer having a thickness of up to about 18 µm during at least 50,000,000 bending cycles and/or a copper layer having a thickness of up to about 35 µm during at least 20,000,000 bending cycles of the flexible laminate; and a second flexible polymeric film.
Lee Chin-Ho
Merchant Harish D.
Poutasse Charles A.
Ga-Tek Inc. (dba Gould Electronics Inc.)
Gowling Lafleur Henderson Llp
Nikko Materials Usa Inc.
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