Surface treatment of semiconductor substrates

Details Surface treatment of semiconductor substrates Surface treatment of semiconductor substrates

H - Electricity

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L

356/178

H01L 21/70 (2006.01) C03C 23/00 (2006.01) H01L 21/306 (2006.01)

Patent

CA 1053382

SURFACE TREATMENT OF SEMICONDUCTOR SUBSTRATES Abstract of the Disclosure The invention comprehends establishing a hydrophilic surface on polished semiconductor wafers, such as silicon, after polishing (e.g. silica polishing) by oxidation and hydrolysis of the wafer surface for conditioning thereof for post-polishing cleaning.

272855

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