Suspended microstructures

Details Suspended microstructures Suspended microstructures

H - Electricity

01

L

H01L 21/64 (2006.01) G01J 5/00 (2006.01) G01J 5/02 (2006.01) G01J 5/20 (2006.01) G03F 7/00 (2006.01) H01L 21/306 (2006.01) H01L 49/00 (2006.01)

Patent

CA 2190077

A suspended microstructure process assembly includes a first microstructure assembly, with a temporary substrate having a first surface and a first microstructure fabricated on the first surface; a second microstructure assembly, including a final substrate having a second surface and a second microstructure fabricated on the second surface; connecting elements for joining the first microstructure assembly to the second microstructure assembly with a predetermined separation and alignment; and a removable bond temporarily securing the first microstructure assembly to the second microstructure assembly until the temporary substrate is removed. The connecting elements may be electrically conductive contacts or electrically nonconductive spacers. Electrically conductive contacts may be supplied to the first microstructure from a back side of the first microstructure assembly. The first microstructure fabricated on the first surface may incorporate a removable layer to enable multiple level suspended structures.

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