C - Chemistry – Metallurgy – 08 – J
Patent
C - Chemistry, Metallurgy
08
J
356/12, 6/218, 1
C08J 7/02 (2006.01) C09K 13/12 (2006.01) C23C 18/20 (2006.01) H05K 3/38 (2006.01)
Patent
CA 2020624
ABSTRACT OF THE DISCLOSURE The swelling agent composition for pretreating a synthetic resin substrate prior to electroless metallization contains a solvent system and includes at least one glycol ether characterized by the following formula I R1-(OCH2?CH2)n-OR2 (I) wherein R1 and R2 are independently selected from the group consisting of alkyl groups and aryl groups and n = 1 to 8, especially diethyleneglycol dimethylether, triethyleneglycol dimethylether, tetraethyleneglycol dimethylether or diethyleneglycol diethylether. The process of completely metallizing a synthetic resin substrate includes pretreating the synthetic resin substrate with the swelling agent composition, etching the substrate in an oxidizing etching solution to form an oxidizing agent residue on the substrate, removing the oxidizing agent residue from the substrate, activating the surface of the substrate and electroless metallizing the surface of the substrate with, fro example, copper.
Bressel Burkhard
Riedl Andrea
Tessmann Detlef
Bressel Burkhard
Marks & Clerk
Riedl Andrea
Schering Aktiengesellschaft
Tessmann Detlef
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