C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
C08K 3/00 (2006.01) C08K 3/38 (2006.01) C08K 5/00 (2006.01) C08K 5/03 (2006.01) C08K 13/02 (2006.01) C08L 77/00 (2006.01)
Patent
CA 2322286
Antimony-free polyamide molding compositions are disclosed having improved flame resistance. These compositions comprise, in with percent, 20-77 % polyamide having a melting point of 215-340 ~C; 10-60 % inorganic filler; 10- 35 % of a flame retardant having 50-70 % bormine; 3-10 % zinc borate; and, 0-2 % of a heat stabilizer.
L'invention porte sur des compositions de moulage polyamide sans antimoine dont l'ininflammabilité a été améliorée. Ces compositions comprennent, en pourcentage en poids, 20 à 77 % d'un polyamide dont le point de fusion est compris entre 215 et 340 ·C; 10 à 60 % d'une charge inorganique; 10 à 35 % d'un composé ignifuge comprenant entre 50 et 70 % de brome; 3 à 10 % de borate de zinc; et 0 à 2 % d'un stabilisant thermique.
Koshida Reiko
Martens Marvin Michael
Tobin Wendy
Willis Joycelyn M.
Bennett Jones Llp
E.i. Du Pont de Nemours And Company
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