C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
C08K 3/34 (2006.01) C08K 9/04 (2006.01)
Patent
CA 2607548
The present disclosure relates generally to resin formulations for sheet molding compounds. Particularly, but not by way of limitation, the disclosure relates to low-density thermosetting sheet molding compounds (SMC) comprising a treated inorganic clay, a thermosetting resin, a low profile agent, a reinforcing agent, a low- density filler, and substantially the absence of calcium carbonate. The thermosetting SMC are used to prepare exterior and structural thermoset articles, e.g. auto parts and panels, etc that have Class A Surface Quality.
L'invention porte d'une manière générale sur des formules de résines pour composés moulés préimprégnés (SMC), et en particulier, et non limitativement, sur des composés SMC thermodurcissables de faible densité comprenant: de l'argile minérale traitée, une résine thermodurcissable, un agent de profil bas, un renforçateur, et une charge de faible densité, mais quasi exempts de carbonate de calcium. Lesdits SMC thermodurcissables servent à préparer des articles thermodurcissables extérieurs et structurels, par exemple des pièces et tableaux pour l'automobile, etc., présentant une qualité de surface A.
Fisher Dennis H.
Sumner Michael J.
Twardowska-Baxter Helena
Ashland Licensing And Intellectual Property Llc
Gowling Lafleur Henderson Llp
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