B - Operations – Transporting – 29 – C
Patent
B - Operations, Transporting
29
C
18/1107
B29C 39/10 (2006.01) B29C 33/20 (2006.01) B29C 33/26 (2006.01) B29C 33/36 (2006.01) B29C 33/48 (2006.01) B29C 44/12 (2006.01) B29C 51/34 (2006.01)
Patent
CA 2005147
ABSTRACT OF THE DISCLOSURE An apparatus for molding a product such as an auto- motive instrument panel of synthetic resin has a first sta- tion including a mechanism for opening and closing a mold assembly, a second station including a mechanism for pouring a resin solution into the mold assembly which is closed, and a third station for hardening the poured resin solution in the mold assembly. A feed mechanism interconnects the first, second, and third stations in a looped configuration for circulating at least three mold assemblies through the first, second, and third stations. The mold assembly includes a first mold die for placing therein a covering sheet of a predetermined shape, a second mold die combinable with the first mold die to define a mold cavity therebet- ween, and a mechanism for pouring a resin foam solution into the mold cavity to form a molding integral with the covering sheet.
Hama Nozomu
Iino Tomio
Ishida Kazumi
Kikuchi Nobuo
Koshiro Akihiko
Honda Giken Kogyo Kabushiki Kaisha (also Trading As Honda Motor Ltd .)
Swabey Ogilvy Renault
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