System and method for incising material

A - Human Necessities – 61 – F

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A61F 9/01 (2006.01)

Patent

CA 2705233

Systems (10) and methods (100) of incising a portion of a material include creating a sub-surface separation in a region of the material, and incising a periphery of the region with a pulsed laser beam to produce an edge of the portion. The edge includes a periodically varying shape to secure the portion to the material when the portion is reintegrated. The system (10) includes a laser (14) producing the pulsed laser beam, a scanner (20) operable in response to a control signal, and a controller (22) coupled to the scanner. The controller produces the control signal. In response to the control signal, the scanner creates a sub-surface separation in the region with the pulsed laser beam and incises the periphery of the region with the pulsed laser beam to produce the edge (72, 78, 84) with the periodically varying shape.

Cette invention concerne des systèmes (10) et des procédés (100) d'incision d'une partie d'un matériau comprenant la création d'une séparation interne dans une zone du matériau, et l'incision d'une périphérie de la zone avec un faisceau laser pulsé pour produire un bord. Ce bord comprend une forme régulièrement variable qui maintient la partie contre le matériau lorsque la partie est réintégrée. Le système (10) comprend un laser (14) produisant le faisceau laser pulsé, un scanner (20) fonctionnant en réponse à un signal de commande, et un système de commande (22) couplé au scanner. Le système de commande produit le signal de commande. En réponse au signal de commande, le scanner crée une séparation interne dans la zone avec le faisceau laser pulsé et incise la périphérie de la zone avec le faisceau laser pulsé pour produire le bord (72, 78, 84) à forme régulièrement variable.

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