System and method for mounting a heat sink

H - Electricity – 01 – L

Patent

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Details

H01L 23/40 (2006.01) H01L 23/467 (2006.01)

Patent

CA 2505619

The invention provides a heat sink assembly having a positionable heat sink permitting the heat sink to be mounted to a substrate in more than one configuration. Various features are described for permitting multiple degrees of freedom in the arrangement of the heat sink assembly. Such features permit the heat sink assembly to be adapted to different environments. The heat sink assembly also has features such as a vane for directing air flow relative to the heat sink. Features for varying and maintaining pressure between the heat sink and a component to be cooled are also included.

L'invention concerne un ensemble dissipateur thermique présentant un dissipateur thermique positionnable permettant au dissipateur thermique d'être monté sur un substrat dans plus d'une configuration. L'invention concerne divers éléments permettant plusieurs degrés de liberté dans l'agencement de l'ensemble dissipateur thermique. Lesdits éléments permettent à l'ensemble dissipateur thermique d'être adapté à des environnements différents. L'ensemble dissipateur thermique présente des éléments tels qu'une aube permettant de diriger la circulation d'air relativement au dissipateur thermique. Des éléments de variation et de maintien de pression sont également compris entre le dissipateur thermique et un composant à refroidir.

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