System and method for polyurethane bonding during and after...

B - Operations – Transporting – 29 – C

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

B29C 39/10 (2006.01)

Patent

CA 2728300

An electrical apparatus according to the present disclosure comprises a molded device having a molded portion and being formed via an overmolding process. The electrical apparatus includes a wire set at least partially overmolded within the device, the wire set having an outer sheath surrounding a plurality of wires. The molded portion surrounds a portion of the wire set. The electrical apparatus further includes polyurethane bonding material occurring between the outer sheath and the molded portion. The polyurethane bonding material bonds at least a portion of the wire set to the molded portion during the overmolding process.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

System and method for polyurethane bonding during and after... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System and method for polyurethane bonding during and after..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method for polyurethane bonding during and after... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1878715

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.