G - Physics – 02 – F
Patent
G - Physics
02
F
G02F 1/01 (2006.01) G02B 26/00 (2006.01) G09F 9/30 (2006.01) B81B 7/02 (2006.01)
Patent
CA 2520358
Physical forces sufficient to deform an electronic device 700 and/or packaging for the electronic device 700 can damage the device. Some mechanical components in a device, for example, in a microelectromechanical device and/or in an interferometric modulator 722 are particularly susceptible to damage. Accordingly, provided herein is a packaging system and packaged electronic device that resists physical damage, a method for manufacturing the same, and a method for protecting an electronic device 700 from physical damage. The packaging system for the electronic device includes one or more spacers 730 that prevent or reduce damage to the electronic device comprising from contact with the a backplate 750. In some embodiments, the packaged electronic device comprising spacers is thinner than a comparable device manufactured without spacers.
Chui Clarence
Cummings William J.
Gally Brian J.
Palmateer Lauren
Idc Llc
Qualcomm Mems Technologies Inc.
Smart & Biggar
LandOfFree
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