B - Operations – Transporting – 22 – D
Patent
B - Operations, Transporting
22
D
B22D 45/00 (2006.01) B22D 30/00 (2006.01) B23K 26/42 (2006.01) C22C 14/00 (2006.01) C22C 19/00 (2006.01)
Patent
CA 2550819
A method for thermal forming includes determining a process window for initiating cooling, locally heating at least one region (22) on a specimen (20) to achieve a pre-selected geometry deformation, initiating active cooling of the heated region within the process window to control at least one material property of the specimen at the heated region and actively cooling the heated region to a pre-selected temperature. A system (10) for thermal forming includes a thermal source (12) for heating the region on the specimen to achieve a pre-selected geometry deformation, an active cooling module (14) for cooling the region to a pre-selected temperature and a control module (16) to control at least one of the thermal source and active cooling module in accordance with a process window to initiate active cooling to control at least one material property of the specimen at the heated region. The process window has an upper time limit for initiating cooling.
Farrell Brian Harlow
Graham Michael Evans
Jones Marshall Gordon
Marte Judson Sloan
Mika David Peter
Company General Electric
Craig Wilson And Company
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