C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 7/02 (2006.01)
Patent
CA 2156164
The present invention is a system comprising a high peel adhesion repositionable system and release agent. The high peel adhesion repositionable system comprises microspheres and a binder including at least one acrylamide moiety. The release agent comprises a polymer having at least one vinyl polymeric segment having a T8 between -10°C and 65°C and at least one siloxane polymeric segment.
Bilski Lori A.
Kumar Ramesh C.
Mertens Timothy A.
Wilson Shari J.
Minnesota Mining And Manufacturing Company
Smart & Biggar
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