H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/9
H01L 23/14 (2006.01)
Patent
CA 1293066
SYSTEM FOR DETACHABLY MOUNTING SEMICONDUCTORS ON CONDUCTOR SUBSTRATE ABSTRACT OF THE DISCLOSURE A semiconductor mounting system is provided for the detachable surface mounting of one or more semiconductor dies on a conductor substrate, such as a ceramic substrate or printed circuit board. The system employs a resilient, anisotropic conductor pad which is interposed between the semiconductor die and the conductor substrate. The conductor pad is capable of conducting electric signals in one direction only, and insulates in the other two orthogonal directions. Thus, by compressing the semiconductor die and resil- ient conductor pad against the conductor substrate, electrical contact is established between contacts on the semiconductor die and corresponding contacts on the conductor substrate. In the preferred embodiment, additional conductor pads are placed over the semicon- ductor dies, and a heat sink placed over the second conductor pads. In this way, the semiconductor dies are mounted in a resilient structure for protection, while heat dissipation is enhanced by the metallic elements in the second conductor pad.
536461
Amdahl Gene M.
Beck Richard L.
Hu Edward H.
Lee Chune
Lee James C.k.
Amdahl Gene M.
Beck Richard L.
Digital Equipment Corporation
Hu Edward H.
Lee Chune
LandOfFree
System for detachably mounting semi-conductors on conductor... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with System for detachably mounting semi-conductors on conductor..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System for detachably mounting semi-conductors on conductor... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1178285