System for dispensing and controlling the temperature of hot...

Details System for dispensing and controlling the temperature of hot... System for dispensing and controlling the temperature of hot...

G - Physics

05

D

341/15.1

G05D 23/24 (2006.01) B05C 17/005 (2006.01)

Patent

CA 1091785

Abstract of the Disclosure In a hot melt adhesive dispensing gun, an electronic circuit is constructed to enable the operator to set a desired temperature to which the glue is heated.This set point is automatically raised a predetermined amount when the glue is flowing in order to compensate for the drop in temperature caused by the loss of heat to the glue and atmosphere.

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