System for packaging of electronic circuits

Details System for packaging of electronic circuits System for packaging of electronic circuits

H - Electricity

01

L

356/167

H01L 23/32 (2006.01) B23K 1/19 (2006.01) H01L 21/50 (2006.01) H01L 23/047 (2006.01) H01L 23/10 (2006.01)

Patent

CA 1209720

A B S T R A C T A brazing technique is described for providing a standard flat pack with a Thermkon base brazed to a Kovar frame through the utilization of an intermediary ring of high thermal conductivity material which prevents flashing onto the Thermkon base. Brazing is accomplished either in a on-step process in which the parts with the intermediary ring are brazed together all at one time with a single heat treatment, or in a two-step process in which the intermediary ring is first brazed to the frame. In a subsequent step, the frame with the intermediary ring brazed thereto, is brazed to the Thermkon base. In either process, the high thermal conductivity of the intermediary ring permits the ring to quickly reach brazing temperature for minimizing flashing.

434387

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