Systems and methods for compressing plasma

H - Electricity – 05 – H

Patent

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H05H 1/00 (2006.01) H05H 1/26 (2006.01) H05H 1/54 (2006.01)

Patent

CA 2750441

Embodiments of systems and methods for compressing plasma are described in which plasma pressures above the breaking point of solid material can be achieved by injecting a plasma into a funnel of liquid metal in which the plasma is compressed and/or heated.

L'invention porte sur des modes de réalisation de systèmes et de procédés pour la compression de plasma, des pressions de plasma supérieures au point de rupture de la matière solide pouvant être obtenues par l'injection d'un plasma dans un entonnoir de métal liquide, dans lequel le plasma est comprimé et/ou chauffé.

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