B - Operations – Transporting – 29 – C
Patent
B - Operations, Transporting
29
C
B29C 49/64 (2006.01) B29C 47/78 (2006.01)
Patent
CA 2696639
A mold cooling system is provided for cooling a polymer product shaped in a mold. The mold cooling system includes a moving manifold having a cooling fluid supply and a cooling fluid return; and a mold housing having a mold surface that defines a cavity. The mold housing has a connector configured to receive the cooling fluid supply and cooling fluid return of the moving manifold; and a passageway that extends through the mold housing adjacent to the mold surface, the passageway connecting the cooling fluid supply and the cooling fluid return when the moving manifold is received in the connector. A method is also provided for cooling an extruded, blow-molded product before the product is released from a mold.
Benkovski Konrad
Kolbet Randall A.
Lavereau Robin
Millward Michael
Scharf Patrick E.
Riches Mckenzie & Herbert Llp
Weber Manufacturing Technologies Inc.
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