Systems and methods for detecting ionizing radiation with an...

Details Systems and methods for detecting ionizing radiation with an... Systems and methods for detecting ionizing radiation with an...

H - Electricity

05

G

H05G 1/00 (2006.01) G01T 1/164 (2006.01) G01T 1/20 (2006.01)

Patent

CA 2458669

A radiation imaging system (20) comprising a scintillator (26), an imager array (30), and a lamination layer (22). Lamination layer (22) bonds and optically couples scintillator (26) to imager array (30). Lamination layer (22) is comprised of a lamination material that is substantially free from void spaces. Radiation imaging system (20) fabrication comprises the steps of disposing lamination layer (22) between a light imager (24) and a scintillator (26) to form a subassembly (150). Light imager (24) comprises imager array (30), an imaging plate surface (34) and a plurality of contact pads (32). Additional steps include subjecting subassembly (150) to a vacuum; heating subassembly (150) to a bonding temperature, exerting a bonding force on subassembly (150), maintaining the vacuum, the bonding temperature and the bonding force until light imager (24) is bonded to the scintillator (26) and the lamination layer (22) is comprised of lamination material that is substantially free from void spaces.

L'invention concerne un système (20) d'imagerie par rayonnement comprenant un scintillateur (26), un réseau (30) imageur et une couche (22) de lamination. La couche (22) de lamination fixe et couple de manière optique le scintillateur (26) au réseau (30) imageur. La couche (22) de lamination comprend un matériau de lamination ne contenant sensiblement pas d'espaces vides. La mise au point d'un système (20) d'imagerie par rayonnement consiste à déposer une couche (22) de lamination entre un imageur lumineux (24) et un scintillateur (26) pour former un sous-ensemble (150). L'imageur lumineux (24) comprend un réseau (30) imageur, une surface (34) de plaque d'imagerie et une pluralité de plots (32) de contact. Des étapes supplémentaires consistent à mettre le sous-ensemble (150) sous vide; à chauffer le sous-ensemble (150) à une température de liaison, exerçant une force de liaison sur le sous-ensemble (150), maintenant le vide, la température de liaison et la force de liaison jusqu'à ce que l'imageur lumineux (24) soit fixé au scintillateur (26), la couche (22) de lamination comprenant un matériau de lamination ne contenant sensiblement pas d'espaces vides.

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