C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
C23C 16/00 (2006.01)
Patent
CA 2609712
A heat-conducting medium for placement between a heat source and heat sink to facilitate transfer of heat from the source to the sink is provided. The heat- conducting medium can include a disk having relatively high thermal conductivity and heat spreading characteristics. The heat-conducting medium also includes a first recessed surface and an opposing second recessed surface. Extending from within each recessed surface is an array of heat conducting bristles to provide a plurality of contact points to the heat source and heat sink to aid in the transfer of heat. The recessed surfaces may be defined by a rim positioned circumferentially about the disk. The presence of the rim about each recessed surface acts to minimize the amount of pressure that may be exerted by the heat sink and the heat source against the bristles. A method for manufacturing the heat-conducting medium is also provided.
Milieu conduisant la chaleur à placer entre une source de chaleur et un puits de chaleur pour faciliter le transfert thermique entre la source et le puits. Le milieu peut comprendre un disque à conductivité thermique et caractéristiques de diffusion thermique relativement élevées. Il comprend aussi une première surface en creux et une seconde surface en creux opposée. Depuis chaque surface s'étend un réseau de soies conduisant la chaleur qui assurent plusieurs points de contact avec la source et le puits dans le transfert de chaleur. Les surfaces peuvent être définies par une bordure périphérique autour du disque. La présence de cette bordure autour de chaque surface réduit au minimum la pression pouvant être exercée par le puits et la source contre les soies. Procédé de fabrication de milieu conduisant la chaleur.
Brown Joseph J.
Lashmore David S.
Gowling Lafleur Henderson Llp
Nanocomp Technologies Inc.
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