Systems and methods for thermal management of lamps and...

H - Electricity – 05 – K

Patent

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Details

H05K 7/20 (2006.01) F21V 29/00 (2006.01) H01L 23/46 (2006.01) H05B 33/02 (2006.01)

Patent

CA 2612973

LED module assemblies and luminaires that reduce thermal issues associated with LED lamp energy dissipation are disclosed. In one embodiment, an optimized conduction path from the LED to the exterior of the luminaire is created through the use of heat pipes integrated into the LED module assembly and luminaire. In this embodiment, a significant reduction in thermal transfer to the interior of the enclosure may be implemented, while allowing maximum energy dissipation from the LEDs.

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