Systems, apparatus and methods for bonding and/or sealing...

Details Systems, apparatus and methods for bonding and/or sealing... Systems, apparatus and methods for bonding and/or sealing...

H - Electricity

01

M

H01M 2/14 (2006.01) H01M 8/02 (2006.01)

Patent

CA 2390949

Apparatus, systems, and methods for bonding one element of an electrochemical cell or cell stack to another wherein a sealing grove with a complex cross-sectional shape receives and retains a bead of adhesive prior to being assembled. The complex cross-sectional shape has a raised portion sized to receive and retain the bead of adhesive, and at least one depressed portion to receive adhesive displaced from the raised portion during assembly. Embodiments of the invention incorporate raised portions with straight, beveled, curved, and rough surfaces to increase the strength of the bond between the respective elements.

Il s'agit d'un appareillage, de systèmes et de méthodes permettant de lier un élément de pile ou un bloc de piles à un autre où une garniture d'étanchéité avec une configuration complexe en coupe, reçoit et retient un cordon d'adhésif avant assemblage. La configuration complexe en coupe comprend une partie calibrée pour recevoir et retenir le cordon d'adhésif, et au moins une partie abaissée pour recevoir l'adhésif déplacé de la partie soulevée lors de l'assemblage. Des versions de cette invention comportent des parties élevées, avec des surfaces rectilignes, biseautées, incurvées et brutes, pour augmenter la résistance du lien entre les éléments respectifs.

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