Systems, devices, and methods for increasing current...

Details Systems, devices, and methods for increasing current... Systems, devices, and methods for increasing current...

H - Electricity

02

B

H02B 1/056 (2006.01) H02G 5/10 (2006.01) H05K 3/30 (2006.01) H05K 7/20 (2006.01)

Patent

CA 2653971

Certain exemplary embodiments can comprise a system, which can comprise basepan (2000) comprising a banding stud (2500,2600). The banding stud can be configured to releasably attach a heat sink (2300,2800) to the basepan. The heat sink configured to increase a current carrying capacity of a system associated with the basepan from a first predetermined level to a second predetermined level.

A titre d'exemple, certains modes de réalisation de l'invention peuvent comporter un système présentant un plateau de base (2 000) équipé d'un élément de fixation (2 500, 2 600). L'élément de fixation peut être configurée pour fixer de façon amovible un dissipateur thermique (2 300, 2 800) au plateau de base. Le dissipateur thermique est configuré pour augmenter une capacité de transport de courant d'un système associé au plateau de base d'un premier niveau prédéterminé à un second niveau prédéterminé.

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