Tape automated bonding of bumped tape on bumped die

Details Tape automated bonding of bumped tape on bumped die Tape automated bonding of bumped tape on bumped die

H - Electricity

01

L

356/134

H01L 21/603 (2006.01) H01L 23/48 (2006.01) H01L 23/485 (2006.01) H01L 23/495 (2006.01)

Patent

CA 1309512

ABSTRACT OF THE DISCLOSURE A tape automated bonding structure (10) includes a copper flexible tape (12) with a plurality of conductive leads (14) having tips (16) arranged in a generally rectan- gular pattern corresponding to gold bumped contacts (18) on semiconductor die (20). The tips (16) of the conductive leads (14) are configured as bumps extending from the remainder of each conductive lead (14). The tips (16) of the conductive leads (14) are gang bonded to the bumped contacts (18) on the semiconductor die (20) by positioning the tips (16) in registration over each bumped contact and applying heat and pressure to urge the tips (16) and the bumped contacts together, thus forming a thermocompression bond. The harder copper tips (16) penetrate into the gold bumped contacts. The bumped contacts (18) and the remainder of the tips (16) that has not penetrated into the contacts (18) space the conductive leads (14) above surface (22) of the semiconductor die (20).

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