Tape-automated-bonding of integrated circuits

Details Tape-automated-bonding of integrated circuits Tape-automated-bonding of integrated circuits

H - Electricity

01

L

356/187

H01L 21/82 (2006.01) H01L 21/48 (2006.01) H01L 21/60 (2006.01) H01L 23/495 (2006.01) H05K 3/40 (2006.01)

Patent

CA 1198833

ABSTRACT A tape for use in tape-automated-bonding of inte- grated circuits comprises series of interconnection arrays arranged along the tape, each array being formed by a number of interconnection beams. A terminal is located on each beam for bonding to a respective interconnection pad of an integrated circuit. The terminals of the tape comprise a conductive material having a Vickers hardness number of 55 or less, and thus have a compliance which facilitates even bonding. The invention includes a method of producing the tape.

406703

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