Tape automated bonding package

Details Tape automated bonding package Tape automated bonding package

H - Electricity

01

L

356/135

H01L 23/522 (2006.01) H01L 23/498 (2006.01) H01L 23/538 (2006.01) H05K 1/14 (2006.01)

Patent

CA 1287693

IMPROVED TAPE AUTOMATED BONDING PACKAGE ABSTRACT OF THE DISCLOSURE The disclosure describes a new and improved Tape Automated Bonding package which admits of certain advantages that are not available with the packages as used in the past, and it overcomes some limitations with the previous packages which permits a significant step forward in realizing these advantages. Briefly, the disclosure describes a division of the dielectric support used to package integrated circuit chips in order to separate the power conductors and the signal conductors into different parts of the support. The conductors formed on at least one of these parts, preferably the part used to connect input/output signals to and from a chip, are arranged in radially extending rows to achieve more than twice the number of such connections.

588787

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