B - Operations – Transporting – 30 – B
Patent
B - Operations, Transporting
30
B
164/88, 154/29.0
B30B 9/00 (2006.01) A43D 11/00 (2006.01) B29C 43/00 (2006.01)
Patent
CA 1055829
Abstract of the Disclosure A die arrangement is provided for use in apparatus for the applicationof relatively thin overlay designs on suitable plastic sheet material. The die comprises a sharp cutting edge in the shape of the design, the edge being beveled away from the overlay, the overlay area of the die inside the cutting edge having a metal filler covered by a resilient material which extends beyond the die edge to compress the overlay during the simultaneous heating and cutting operation.
221110
Brophy Thomas G.
Crowell Douglas H.
Hollick John G.
Corporation Usm
Na
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