Technique for manufacturing integrated optics devices

Details Technique for manufacturing integrated optics devices Technique for manufacturing integrated optics devices

G - Physics

02

B

G02B 6/136 (2006.01)

Patent

CA 2190884

The present disclosure describes a method for fabrication of integrated optic waveguide devices utilizing photosensitive material on a variety of substrate materials. The method comprises the steps of a) making a sample that consists of a slab layer on a substrate; and b) depositing a thin layer of photosensitive material on the sample; and c) placing a photolithography mask, having an opening corresponding to an optical component, device circuit layout, on the photosensitive layer after the step (b); and d) exposing the sample with ultraviolet light to increase the refractive index of the photosensitive materials in the opening regions of the mask, and e) removing themask. The desired integrated optic component, device or circuit is formed in the slab layer due to an increase in the refractive index of the photosensitive layer on its top.

An isolator surge protector (ISP) is provided which blocks DC current and passes AC current and AC and DC fault currents. The ISP includes a main bypass path, including main bypass path switching devices, that is connected in parallel with a DC blocking capacitor. Primary triggering of the main bypass path switching devices occurs when the voltage across the ISP exceeds a primary voltage trigger level. Repeated triggering of the bypass path switching devices, and high current discharge of the high voltage DC blocking capacitor through the bypass path, under abnormal steady state voltage conditions, is prevented by initiating a secondary triggering period following primary triggering of the bypass path switching devices.

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