Telecommunication device with a combiner-splitter

H - Electricity – 03 – F

Patent

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Details

H03F 3/19 (2006.01) H01P 5/12 (2006.01) H03F 3/68 (2006.01)

Patent

CA 2254542

A multicarrier linear RF power amplifier incorporating an improved signal splitter and an improved signal combiner is disclosed. The amplifier comprises a plurality of wedge-shaped amplifier modules. When such modules are radially disposed and abutted against one another, the inwardly facing edges of the modules collectively define a central or axially-located opening. An improved signal sputter, signal combiner, or dual splitter/combiner is advantageously disposed in the axially- located opening. The signal sputter or signal combiner is a conductor arrangement comprising a plurality of equal length conductors radially disposed on a dielectric substrate. The conductor arrangement is advantageously disposed within a suitably configured housing. The housing is disposed within the axially-located opening.

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