H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 23/34 (2006.01) H01L 23/373 (2006.01) H04R 1/04 (2006.01) H04R 3/00 (2006.01) H05K 7/20 (2006.01)
Patent
CA 2747655
An electronic device includes a housing, a printed circuit board, a first heat sink and a second heat sink. The printed circuit board is disposed internal to the housing and supports at least one integrated circuit (IC) chip. The first heat sink is also disposed internal to the housing and is thermally connected to the at least one IC chip. The second heat sink is connected to the housing such that at least a portion thereof is externally disposed to the housing. The second heat sink is thermally connected to the first heat sink via an aperture in the housing.
Le dispositif électronique selon l'invention comprend un boîtier, une carte de circuit imprimé, un premier dissipateur thermique et un second dissipateur thermique. La carte de circuit imprimé est disposée à l'intérieur du boîtier et supporte au moins une puce de circuit intégré (CI). Le premier dissipateur thermique est aussi disposé à l'intérieur du boîtier et est thermiquement connecté à la (aux) puce(s) CI. Le second dissipateur thermique est connecté au boîtier de sorte qu'au moins une de ses parties soit disposée à l'extérieur du boîtier. Le second dissipateur thermique est thermiquement connecté au premier dissipateur thermique via une ouverture dans le boîtier.
Shohet Yuval
Theerawong Teerapat
Mbm Intellectual Property Law Llp
Openpeak Inc.
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