Temperature compensation for diffused semiconductor strain...

G - Physics – 01 – L

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

328/199, 73/70

G01L 9/00 (2006.01) G01D 3/036 (2006.01) G01L 1/22 (2006.01) G01L 9/06 (2006.01)

Patent

CA 1189352

TEMPERATURE COMPENSATION FOR DIFFUSED SEMICONDUCTOR STRAIN DEVICES Abstract of the Disclosure A system for extending the temperature range over which diffused semiconductor strain sensing devices specifically can be used includes a semiconductor chip having a base material and a semiconductor device formed in the base material. Biasing potential is applied to the base material and excitation potential applied to the diffused device. The biasing potential and the excitation potential are selected relative to one another to permit a predetermined variation in the semiconductor device characteristic with temperature over an extended temperature range. In the semiconductor strain sensing application, this predetermined characteristic is the impedence of the device. In this way, compensation for the variation of the characteristic can be applied to extend the useful temperature range for the semiconductor device. In particular, the design considerations to achieve the relative biasing uniquely provide the relative potentials in a simple manner, providing for low cost devices with the desired extended temperature range.

435445

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Temperature compensation for diffused semiconductor strain... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Temperature compensation for diffused semiconductor strain..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Temperature compensation for diffused semiconductor strain... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1293115

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.