Temperature control system for semiconductor wafer or substrate

H - Electricity – 01 – L

Patent

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356/187

H01L 21/00 (2006.01) H01L 21/683 (2006.01)

Patent

CA 2039844

ABSTRACT OF THE DISCLOSURE A temperature control system may be used in conjunction with the sputtering, CDV. etching, and like processes for a substrate on which the semiconductor devices are implemented. This system responds quickly to any change in the temperature of the substrate being processed. by heating or cooling the substrate to the appropriate temperature and maintaining it at its constant temperature.

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