Temperature regulator for a substrate in vapour deposition...

C - Chemistry – Metallurgy – 23 – C

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C23C 16/44 (2006.01) C23C 16/00 (2006.01) C23C 16/458 (2006.01) C23C 16/46 (2006.01) C30B 25/10 (2006.01) C30B 25/12 (2006.01) C23C 16/26 (2006.01)

Patent

CA 2326228

A heat transfer regulating mixture having a metallic component A with a melting point T A and a particulate ceramic component B which is non-wettable by the metallic component A, non- reactive therewith and which has a melting temperature T B which is higher than both the temperature T A and a desired operating temperature T D which is also higher than T A. The metallic component A and the particulate ceramic component B and the respective amounts will typically be selected to have a higher thermal resistivity above T A than below T A. The heat transfer regulating mixture may be incorporated in the heat transfer regulating device having the mixture within an enclosure having first and second contact faces.

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