C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 33/24 (2006.01) C08L 33/26 (2006.01) D21H 17/37 (2006.01) D21H 21/20 (2006.01) C08L 39/00 (2006.01) D21H 17/45 (2006.01)
Patent
CA 2260194
Compositions comprising a blend of (1) an ionic, water-soluble, vinylamide polymer containing sufficient vinylamide and -CHOHCHO substituents to be thermosetting and a ratio of glyoxal substituents to glyoxal-reactive substituents in excess of about 0.02:1.0 and (2) a glyoxalated, cationic, water-soluble vinylamide polymer having a molecular weight of about 500 to about 6000, sufficient glyoxal-reactive and glyoxal substituents to be thermosetting and a ratio of glyoxal substituents to vinylamide substituents being in an excess of about 0.1:1.0, are disclosed.
L'invention concerne des compositions comprenant un mélange de: (1) un polymère vinylamidique, hydrosoluble, ionique, contenant suffisamment de vinylamide et de substituants -CHOHCHO pour être thermodurcissable ainsi que des substituants du type glyoxal et des substituants réagissant aux substituants du type glyoxal selon un rapport dépassant environ 0,02:1,0, et (2) un polymère vinylamidique, hydrosoluble, cationique, glyoxalaté, d'un poids moléculaire d'environ 500 à environ 6000, contenant suffisamment de substituants réagissant aux substituants du type glyoxal et de substituants du type glyoxal pour être thermodurcissable, le rapport des substituants du type glyoxal aux substituants vinylamides dépassant environ 0,1:1,0.
Dauplaise David L.
Guerro Gerald J.
Cytec Technology Corp.
Kemira Oyj
Smart & Biggar
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