C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
C08G 69/26 (2006.01) C08L 77/06 (2006.01) D01F 6/80 (2006.01)
Patent
CA 2097615
A partially crystalline copolyamide formed from an aromatic carboxylic acid that is terephthalic acid or a mixture of ter- ephthalic acid and isophthalic acid containing less than 40 % of isophthalic acid, and an aliphatic diamine that is a mixture of hexamethylene diamine and 2-methyl pentamethylene diamine. The aliphatic diamine is at least 44 %, molar basis, of hexamethy- lene diamine and the amount of isophthalic acid plus 2-methyl pentamethylene diamine is in the range of 15-35 %, molar basis. of the total amount of aromatic carboxylic acid and aliphatic diamine. The copolyamides have a melting point of 280-330 °C. The copolyamide preferably has a heat of fusion of greater than 17 J/g. The copolyamide may be moulded into articles, spun into fi- bres or formed into films, and used in a wide variety of end-uses especially where high temperature properties are required.
Mok Steven Lai-Kwok
Pagilagan Rolando U.
Bennett Jones Llp
E. I. Du Pont de Nemours And Company
E.i. Du Pont de Nemours And Company
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