Terminal lead construction for electrical circuit substrate

Details Terminal lead construction for electrical circuit substrate Terminal lead construction for electrical circuit substrate

H - Electricity

05

K

26/31, 339/11.6

H05K 1/11 (2006.01) H01L 23/498 (2006.01) H01R 43/00 (2006.01) H05K 1/16 (2006.01) H05K 3/34 (2006.01) H05K 1/03 (2006.01) H05K 1/09 (2006.01) H05K 1/14 (2006.01) H05K 3/40 (2006.01)

Patent

CA 1055134

Abstract of the Disclosure An electrical circuit device having a substrate including circuit components on at least one side thereof and a plurality of through openings in the substrate. Terminal lead-R are positioned in the openings each with a deformation intermediate the ends of the leads and spaced internally of the opening from a soldered area at the juncture of the exposed portion of the leads and the termination edge of the substrate. Two methods of assembly of leads to the substrate are also disclosed.

257814

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