Tetrapolyimide film containing oxydiphthalic dianhydride

Details Tetrapolyimide film containing oxydiphthalic dianhydride Tetrapolyimide film containing oxydiphthalic dianhydride

C - Chemistry, Metallurgy

08

G

C08G 73/10 (2006.01) B29C 41/24 (2006.01) B29C 41/46 (2006.01) C08J 5/18 (2006.01) H01L 23/14 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2057420

PE-0153 TITLE TETRAPOLYIMIDE FILM CONTAIMING OXYDIPHTHALIC DIANHYDRIDE ABSTRACT OF THE DISCLOSURE Tetrapolyimide films derived from oxydiphthalic dianhydride, pyromellitic acid dianhydride, p-phenylene diamine and 4,4'-diaminodiphenyl ether, and their preparation are described. The tetrapolymer films have low water absorption, low coefficients of thermal and hygroscopic expansion, high modulus and are caustic etchable and can be used in flexible printed circuit and tape automated bonding applications.

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