C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
149/12.1
C23C 18/22 (2006.01) H05K 3/38 (2006.01)
Patent
CA 1302851
Textured Polyimide Film ABSTRACT one or both surfaces of a polyimide sheet are uniformly and completely textured and can be coated with a layer of electroless nickel or cobalt and a subsequent layer of electrolytically ap- plied copper yielding an adhesiveless laminate useful in the pro- duction of electronic circuitry. The copper and nickel or cobalt layers can be strongly bonded to the textured polyimide sheet to the extent that the laminate exceeds bond strength requirements as measured by current standard peel strength tests of the Institute for Interconnecting and Packaging Electronic Circuits (IPC) for both initial and post solder float adhesion. (1)
557905
Polyonics Corporation
Riches Mckenzie & Herbert Llp
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