Thermal barrier coating systems

C - Chemistry – Metallurgy – 22 – C

Patent

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C22C 19/05 (2006.01) C23C 28/00 (2006.01)

Patent

CA 2708886

Coating system for a metallic substrate includes a strengthened bond coat including a bond coat inner layer and an aluminum-containing layer overlying the bond coat inner layer. The bond coat inner layer is formed by deposition of a bond coat composition including, in weight percent, 14-20 % Cr, 5-8 % Al, 8-12 % Co, 3-7 % Ta, 0.1-0.6 % Hf, 0.1-0.5 % Y, up to about 1% Si, 0.005-0.020 % Zr, 0.04-0.08 % C, 0.01- 0.02% B, with a remainder including Ni and incidental impurities, wherein the bond coat composition is substantially free of rhenium. The coating system includes an optional thermal barrier coating which may be a yttria-stabilized zirconia.

La présente invention concerne un système de revêtement pour un substrat métallique qui comprend une couche de liaison renforcée comportant une couche interne de liaison et une couche contenant de l'aluminium surplombant la couche interne de liaison. La couche interne de liaison est formée par le dépôt d'une composition de couche de liaison comprenant, en pourcentage en poids, 14-20 % de Cr, 5-8 % de Al, 8-12 % de Co, 3-7 % de Ta, 0,1-0,6 % de Hf, 0,1-0,5 % de Y, jusqu'à environ 1% de Si, 0,005-0,020 % de Zr, 0,04-0,08 % de C, 0,01- 0,02% de B, le reste étant formé par le Ni et les impuretés inévitables, ladite composition de couche de liaison étant sensiblement dépourvue de rhénium. Le système de revêtement comprend un revêtement formant barrière facultatif qui peut être formé de zircone stabilisée par l'yttria.

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