Thermal compensation for magnetic head assembly

Details Thermal compensation for magnetic head assembly Thermal compensation for magnetic head assembly

G - Physics

11

B

352/30.01

G11B 5/58 (2006.01) G11B 5/105 (2006.01)

Patent

CA 1182214

THERMAL COMPENSATION FOR MAGNETIC HEAD ASSEMBLY Abstract of the Disclosure Ferrite read and write modules of a magnetic head assembly that are aligned and positioned within a nonferrite housing are clamped by a leaf spring between the walls of the housing. The leaf spring compensates for thermal mismatch between the ferrite modules and the housing, and compensates for stress fluctuation that occurs with temperature change. The clamping force of the leaf spring is precisely controlled.

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