Thermal conduction element for semiconductor devices

Details Thermal conduction element for semiconductor devices Thermal conduction element for semiconductor devices

H - Electricity

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H01L 23/42 (2006.01) H01L 23/36 (2006.01) H01L 23/367 (2006.01) H01L 23/433 (2006.01)

Patent

CA 1187208

Thermal Conduction Element For Semiconductor Devices Abstract A disk shaped thermal bridge element for use in a semiconductor package to conduct heat from a device to a cold plate, which disk element has a bulged shape with a first set of inwardly extending slots and a second set of outwardly extending slots emanating from the center of the disk.

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