H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 23/42 (2006.01) H01L 21/56 (2006.01) H01L 23/373 (2006.01)
Patent
CA 2537830
Thermal interface compositions (10) contain both non-electrically conductive micronsized fillers (18) and electrically conductive nanoparticles (20) blended with a polymer matrix (16). Such compositions increase the bulk thermal conductivity of the polymer composites as well as decrease thermal interfacial resistances that exist between thermal interface materials and the corresponding mating surfaces. Such compositions are electrically non- conductive. Formulations containing nanoparticles (20) also show less phase separation of micron-sized particles (18) than formulations without nanoparticles (20). Methods for increasing heat transfer include using such compositions between heat producing components (12) and heat sinks (14). Electronic components utilizing such compositions are also disclosed.
La présente invention se rapporte à des compositions d'interface thermique (10), qui contiennent à la fois des charges microniques non conductrices (18) et des nanoparticules conductrices (20) mélangées à une matrice polymère (16). De telles compositions augmentent la conductivité thermique globale des composites polymères, et réduisent les résistances interfaciales thermiques qui se produisent entre les matières d'interface thermique et les surfaces de contact correspondantes. De telles compositions sont non conductrices. Des préparations contenant des nanoparticules (20) présentent en outre une séparation en phases des particules microniques (18) plus faible que les préparations ne contenant pas de nanoparticules (20). L'invention a également trait à des procédés permettant d'augmenter le transfert de chaleur, qui utilisent de telles compositions entre des composants produisant de la chaleur (12) et des dissipateurs thermiques (14). L'invention concerne aussi des composants électroniques faisant appel à de telles compositions.
Fillion Raymond Albert
Simone Davide Louis
Tonapi Sandeep Shrikant
Zhong Hong
Company General Electric
Craig Wilson And Company
LandOfFree
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