Thermal head and its fabrication method

Details Thermal head and its fabrication method Thermal head and its fabrication method

B - Operations, Transporting

41

J

B41J 2/345 (2006.01) B41J 2/335 (2006.01) H04N 1/23 (2006.01) H05K 3/36 (2006.01) H05K 3/00 (2006.01)

Patent

CA 2236609

A structure and a fabrication method of an economical thermal head is provided. The thermal head comprises a substrate carrying a row of heat generating resistors selectively driven by an integrated circuit. The substrate is electrically connected to a flexible portion of a printed circuit board for connection to an external power source. The substrate and flexible circuit board portion are adhered to a contiguously flat face of a heat radiating plate by using either a two-sided adhesive tape or screen printed adhering agent, while flexing the flexible circuit board portion to adapt to the substrate thickness.

Cette invention concerne la configuration d'une tête thermique économique et la méthode de fabrication correspondante. La tête thermique comprend un substrat portant une rangée de résistances chauffantes énergisées de façon sélective par un circuit intégré. Le substrat est raccordé à une partie flexible d'une carte à circuit imprimé pour son alimentation électrique à partir d'une source extérieure. Le substrat et la partie flexible de la carte à circuit imprimé sont collés à la face plane contiguë d'une plaque chauffante au moyen soit d'un ruban adhésif double face soit d'une colle déposée par technique sérigraphique toute en pliant la partie flexible de la carte à circuit imprimé en fonction de l'épaisseur du substrat.

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