Thermal management materials

H - Electricity – 01 – L

Patent

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H01L 23/373 (2006.01) H01L 23/427 (2006.01)

Patent

CA 2524608

A thermally-conductive compound for forming a layer which is conformable between a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween. The compound is an admixture of a thermal grease component and a dispersed constituent forming discrete domains within the grease component, the domains being form-stable at normal room temperature in a first phase and conformable between the first and second heat transfer surface in a second phase, and the domains having a domain transition temperature above normal room temperature from the first phase to the second phase. The dispersed constituent may be a fusible, i.e., low temperature melting, metal or metal alloy.

L'invention concerne un composé thermoconducteur destiné à former une couche conformable entre une première surface de transfert thermique et une seconde surface de transfert thermique opposée de manière à créer entre elles un passage thermique. Ledit composé est un mélange de composant de graisse thermique et de constituant dispersé formant des domaines discrets à l'intérieur du composant de graisse, lesdits domaines étant de forme stable à température ambiante normale dans une première phase et conformable entre les première et seconde surfaces de transfert thermique dans une seconde phase, et les domaines ayant une température de transition de domaine supérieure à la température ambiante normale de la première à la seconde phases. Le constituant dispersé peut être un fusible, c'est-à-dire un métal ou un alliage métallique fondant à basse température.

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