Thermal management of electronic components using synthetic...

Details Thermal management of electronic components using synthetic... Thermal management of electronic components using synthetic...

H - Electricity

01

L

H01L 23/373 (2006.01)

Patent

CA 2138095

A method is set forth for forming a heat-sinked electronic components, comprising the following steps: depositing, at a first deposition rate, a first layer of synthetic diamond having a relatively high thermal conductivity; depositing, on the first layer, at a second deposition rate that is higher than the first deposition rate, a second layer of synthetic diamond having a relatively low thermal conductivity; and mounting an electronic component on the first layer of synthetic diamond. Alternatively, the layers may be deposited in the opposite order.

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