Thermal management system

H - Electricity – 05 – K

Patent

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Details

H05K 7/20 (2006.01) H01L 21/48 (2006.01) H01L 23/373 (2006.01)

Patent

CA 2401619

The present invention relates to a system for managing the heat from a heat source like an electronic component. More particularly, the present invention relates to a system effective for dissipating the heat generated by an electronic component using a thermal management system that includes a thermal interface formed from a flexible graphite sheet and/or a heat sink formed from a graphite article.

L'invention concerne un système destiné à gérer la chaleur dégagée par une source de chaleur, telle qu'un composant électronique. Elle concerne plus particulièrement un système efficace pour dissiper la chaleur produit par un composant électronique qui utilise un système de gestion de chaleur comprenant une interface thermique formée par une feuille de graphite souple et/ou un puits de chaleur formé à partir d'un objet en graphite.

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